NVIDIA Delivers First Graphics Processor in 0.13 Micron Semiconductor Process
Deep Sub-Micron Process Technology Enables PC Industry’s Most Advanced Cinematic GPU
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FOR IMMEDIATE RELEASE:
FALL COMDEX 2002—LAS VEGAS, NV—NOVEMBER 18, 2002—NVIDIA Corporation (Nasdaq: NVDA), the worldwide leader in visual processing solutions, today announced that its new groundbreaking graphics processing unit (GPU), the NVIDIA® GeForce™ FX GPU, is the first to be manufactured on Taiwan Semiconductor Manufacturing Company’s (TSMC’s) (TAIEX: 2330, NYSE: TSMC) 0.13 μm (micron) and copper process, the most advanced semiconductor manufacturing process used in the graphics industry today. The GeForce FX GPU—the industry’s first GPU to deliver real-time, cinematic quality graphics and special effects on the desktop PC, will begin volume manufacturing on 300 mm wafers in the Company’s fourth fiscal quarter ending January 2003.
“The opportunity for innovation is a key factor in the success of the GeForce FX GPU,” said David Kirk, Chief Scientist at NVIDIA. “Delivering a truly revolutionary graphics processor simply isn’t possible using older process technologies like 0.15 micron. The 0.13 micron manufacturing process has allowed us to build small, fast transistors—which are the building blocks for delivering groundbreaking GPUs. By doing so, we’ve created a revolutionary new GPU packed with performance and an unmatched feature set.”
The NVIDIA GeForce FX GPU combines TSMC’s new 0.13 micron process with lower power transistors and high-speed copper interconnects, resulting in a higher-performance, 125 million transistor graphics processor—the most complex GPU in the graphics industry.
“NVIDIA’s transition to the 0.13-micron process is a major step forward in the rapid growth of the graphics industry,” stated Rick Tsai, President and COO at TSMC. “Together, TSMC and NVIDIA share a vision based on innovative design, advanced technology and responsive customer service as we continue to meet very aggressive adoption rates for NVIDIA at 0.13 micron. TSMC will continue to apply its industry-leading technology and manufacturing to the early delivery of 0.13 micron tape-outs to NVIDIA and all our valued customers.”
TSMC owns Taiwan’s first and most advanced production facility to date. At the end of 2000, TSMC delivered the industry’s first 300mm customer’s wafers at 0.18μm technology. In early April of 2001, TSMC marked another major milestone by successfully producing 0.13μm 4Mb SRAM test chips
Certain statements in this press release, including the statements relating to the Company's performance expectations for NVIDIA's family of products and expectations of continued revenue growth, are forward-looking statements that are subject to risks and uncertainties that could cause results to be materially different than expectations. Such risks and uncertainties include, but are not limited to, manufacturing and other delays relating to new products, difficulties in the fabrication process and dependence of the Company on third-party manufacturers, general industry trends including cyclical trends in the PC and semiconductor industries, the impact of competitive products and pricing alternatives, market acceptance of the Company's new products, and the Company's dependence on third-party developers and publishers. Investors are advised to read the Company's Annual Report on Form 10-K and quarterly reports on Form 10-Q filed with the Securities and Exchange Commission, particularly those sections entitled "Certain Business Risks," for a fuller discussion of these and other risks and uncertainties.
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