Buy the Latest Jetson Products

Shop All Jetson Nano Products

DEVELOPER KIT
Module

Overview
Specs

NVIDIA^® Jetson Nano^™ Developer Kit is a small, powerful computer that lets you run multiple neural networks in parallel for applications like image classification, object detection, segmentation, and speech processing. All in an easy-to-use platform that runs in as little as 5 watts.

For detailed information on all NVIDIA Jetson Nano products, please click here.

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Developer Kit Technical Specifications
GPU	128-core Maxwell
CPU	Quad-core ARM A57 @ 1.43 GHz
Memory	4 GB 64-bit LPDDR4 25.6 GB/s
Storage	microSD (not included)
Video Encoder	4K @ 30 \| 4x 1080p @ 30 \| 9x 720p @ 30 (H.264/H.265)
Video Decoder	4K @ 60 \| 2x 4K @ 30 \| 8x 1080p @ 30 \| 18x 720p @ 30\| (H.264/H.265)
Camera	2x MIPI CSI-2 DPHY lanes
Connectivity	Gigabit Ethernet, M.2 Key E
Display	HDMI and DP
USB	4x USB 3.0, USB 2.0 Micro-B
Others	GPIO, I2C, I2S, SPI, UART
Mechanical	100 mm x 80 mm x 29 mm

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Jetson developer kits are for software development and system prototyping. Learn more here.

Overview
Specs

Jetson Nano has the performance and capabilities needed to run modern AI workloads fast, making it possible to add advanced AI to any product. Jetson Nano brings AI to a world of new embedded and IOT applications, including entry-level network video recorders (NVRs), home robots, and intelligent gateways with full analytics capabilities.

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Technical Specifications
GPU	NVIDIA Maxwell^™ architecture with 128 NVIDIA CUDA^® cores 0.5 TFLOPs (FP16)
CPU	Quad-core ARM^® Cortex^®-A57 MPCore processor
Memory	4 GB 64-bit LPDDR4 1600MHz - 25.6 GB/s
Storage	16 GB eMMC 5.1 Flash
Video Encode	250 MP/sec 1x 4K @ 30 (HEVC) 2x 1080p @ 60 (HEVC) 4x 1080p @ 30 (HEVC)
Video Decode	500 MP/sec 1x 4K @ 60 (HEVC) 2x 4K @ 30 (HEVC) 4x 1080p @ 60 (HEVC) 8x 1080p @ 30 (HEVC)
Camera	12 lanes (3x4 or 4x2) MIPI CSI-2 D-PHY 1.1 (18 Gbps)
Connectivity	Wi-Fi requires external chip
	10/100/1000 BASE-T Ethernet
Display	HDMI 2.0 or DP1.2 \| eDP 1.4 \| DSI (1 x2) 2 simultaneous
UPHY	1 x1/2/4 PCIE, 1x USB 3.0, 3x USB 2.0
I/O	3x UART, 2x SPI, 2x I2S, 4x I2C, GPIOs
Size	69.6 mm x 45 mm
Mechanical	260-pin edge connector

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Shop All Jetson AGX Xavier Products

Developer Kit
JETSON AGX XAVIER 8GB MODULE
JETSON AGX XAVIER MODULE

Overview
Specs

With the NVIDIA Jetson AGX Xavier developer kit, you can easily create and deploy end-to-end AI robotics applications for manufacturing, delivery, retail, smart cities, and more. Supported by NVIDIA JetPack and DeepStream SDKs, as well as CUDA^®, cuDNN, and TensorRT software libraries, the kit provides all the tools you need to get started right away. And because it’s powered by the new NVIDIA Xavier processor, you now have more than 20X the performance and 10X the energy efficiency of its predecessor, the NVIDIA Jetson TX2. Get started today with the Jetson AGX Xavier Developer Kit.

For detailed information on all Jetson Xavier products, please click here

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	Developer Kit Technical Specifications
GPU	512-Core Volta GPU with Tensor Cores
CPU	8-Core ARM v8.2 64-Bit CPU, 8 MB L2 + 4 MB L3
Memory	32 GB 256-Bit LPDDR4x \| 137 GB/s
Storage	32 GB eMMC 5.1

Developer Kit I/Os	Jetson AGX Xavier Module Interface
PCIe X16	X8 PCIe Gen4/x8 SLVS-EC
RJ45	Gigabit Ethernet
USB-C	2x USB 3.1, DP (Optional), PD (Optional) Close-System Debug and Flashing Support on 1 Port
Camera Connector	(16x) CSI-2 Lanes
M.2 Key M	NVMe
M.2 Key E	PCIe x1 + USB 2.0 + UART (for Wi-Fi/LTE) / I2S + DMIC + GPIOs
40-Pin Headers	UART + SPI + CAN + I2 C + I2 S + DMIC + GPIOs
HD Audio Header	High-Definition Audio
eSTATp + USB 3.0 Type A	SATA Through PCIe x1 Bridge + USB 3.0 (PD + Data for 2.5-inch SATA)
HDMI Type A	HDMI 2.0
µSD/UFS Card Socket	SD/UFS

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Jetson developer kits are for software development and system prototyping. Learn more here.

Overview
SPECS

Jetson AGX Xavier 8GB is a lower-power lower-price Jetson AGX Xavier offering full hardware and software compatibility with the existing Jetson AGX Xavier. It consumes a maximum of 20W for the full module whilst delivering up to 20 TOPS of AI performance.

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Technical Specifications
GPU	NVIDIA Volta^™ architecture with 384 NVIDIA CUDA cores and 48 Tensor cores 5.5 TFLOPS (FP16) 11.1 TOPS (INT8)
DL Accelerator	4.1 TFLOPS (FP16) 8.2 TOPS (INT8)
CPU	6-core Carmel ARM v8.2 64-bit CPU, 8MB L2 + 4MB L3
Memory	8GB 256-bit LPDDR4x - 1333 MHz - 85.3 GB/s
Display	Three multi-mode DP 1.2a/e DP 1.4/HDMI 2.0 a/b
Storage	32GB eMMC 5.1
Vision Accelerator	7-Way VLIW Vision Processor
Video Encode	2x464 MP/sec 2x 4K @ 30 (HEVC) 6x 1080p @ 60 (HEVC) 14x 1080p @ 30 (HEVC)
Video Decode	2x690 MP/sec 2x 4K @ 60 (HEVC) 4x 4K @ 30 (HEVC) 12x 1080p @ 60 (HEVC) 24x 1080p @ 30 (HEVC) 16x 1080p @ 30 (H.264)
Camera	16 lanes MIPI CSI-2, 8 lanes SLVS-EC D-PHY (40 Gbps), C-PHY(64 Gbps)
UPHY	3x USB 3.1, 4x USB 2.0 1 x8 or 1 x4 or 1 x2 or 2 x1 PCIe (Gen3)
Other	UART, SPI, CAN, I2C, I2S, DMIC, GPIOs
Connectivity	Wi-Fi requires external chip
	10/100/1000 RGMII Gigabit Ethernet
Size	100 mm x 87 mm
Mechanical	699 pin Connector Integrated Thermal Transfer Plate

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Overview
SPECS

The Jetson AGX Xavier module makes AI-powered autonomous machines possible, running in as little as 10W and delivering up to 32 TOPs. As part of the world’s leading AI computing platform, it benefits from NVIDIA’s rich set of AI tools and workflows, enabling developers to quickly train and deploy neural networks.

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Technical Specifications
GPU	NVIDIA Volta^™ architecture with 512 NVIDIA CUDA cores and 64 Tensor cores 11 TFLOPS (FP16) 22 TOPS (INT8)
DL Accelerator	5 TFLOPS (FP16) 10 TOPS (INT8)
CPU	8-Core Carmel ARM v8.2 64-Bit CPU, 8 MB L2 + 4 MB L3
Memory	16 GB 256-Bit LPDDR4x 2133 MHz - 136.5 GB/s
Display	Three multi-mode DP 1.2a/e DP 1.4/HDMI 2.0 a/b
Storage	32 GB eMMC 5.1
Vision Accelerator	7-Way VLIW Vision Processor
Video Encode	2x1000 MP/sec 4x 4K @ 60 (HEVC) 8x 4K @ 30 (HEVC) 16x 1080p @ 60 (HEVC) 32x 1080p @ 30 (HEVC)
Video Decode	2x1500 MP/sec 2x 8K @ 30 (HEVC) 6x 4K @ 60 (HEVC) 12x 4K @ 30 (HEVC) 26x 1080p @ 60 (HEVC) 52x 1080p @ 30 (HEVC) 30x 1080p @ 30 (H.264)
Camera	16 lanes MIPI CSI-2, 8 lanes SLVS-EC D-PHY (40 Gbps), C-PHY(109 Gbps)
UPHY	(8x) PCIe Gen4 / (8x) SLVS-EC (3x) USB 3.1 Single Lane UFS
Other	UART, SPI, CAN, I2C, I2S, DMIC, GPIOs
Connectivity	Wi-Fi requires external chip
	10/100/1000 RGMII Gigabit Ethernet
Size	87 mm x 100 mm
Mechanical	699 pin Molex Mirror Mex Connector Integrated Thermal Transfer Plate

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Shop All Jetson TX2 Products

Developer Kit
TX2 4GB MODULE
TX2 MODULE
TX2i MODULE

Overview
Specs

The NVIDIA Jetson TX2 Developer Kit gives you a fast, easy way to develop hardware and software for the Jetson TX2 AI supercomputer on a module. It exposes the hardware capabilities and interfaces of the module and is supported by NVIDIA Jetpack—a complete SDK that includes the BSP, libraries for deep learning, computer vision, GPU computing, multimedia processing, and much more.

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Developer Kit I/Os
PCIe	Gen 2 \| 1x4 + 1x1 OR 2x1 + 1x2
USB	USB 3.0 + USB 2.0
Camera	Up to 6 Cameras (2 Lane) CSI2 D-PHY 1.2 (2.5 Gbps/Lane)
Connectivity	Connects to 801.11ac WLAN and Bluetooth
Storage	32 GB eMMC
Display	HDMI
Others	GPIO, I2 C, I2 S, SPI, CAN, UART

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Jetson developer kits are for software development and system prototyping. Learn more here.

Overview
Specs

Jetson TX2 is a 7.5-watt supercomputer on a module that brings true AI computing at the edge. It's built around an NVIDIA Pascal^™-family GPU and loaded with 8 GB of memory and 59.7 GB/s of memory bandwidth. It features a variety of standard hardware interfaces that make it easy to integrate it into a wide range of products and form factors.

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Technical Specifications
GPU	NVIDIA Pascal^™ architecture with 256 NVIDIA CUDA cores 1.3 TFLOPS (FP16)
CPU	Dual-core Denver 2 64-bit CPU and quad-core ARM A57 complex
Memory	8 GB 128-bit LPDDR4 1866MHz - 59.7 GB/s
Storage	32 GB eMMC 5.1
Video Encode	500 MP/sec 1x 4K @ 60 (HEVC) 3x 4K @ 30 (HEVC) 4x 1080p @ 60 (HEVC) 8x 1080p @ 30 (HEVC)
Video Decode	1000 MP/sec 2x 4K @ 60 (HEVC) 4x 4K @ 30 (HEVC) 7x 1080p @ 60 (HEVC) 14x 1080p @ 30 (HEVC)
Connectivity	Wi-Fi onboard
	10/100/1000 BASE-T Ethernet
Camera	12 lanes MIPI CSI-2, D-PHY 1.2 (30 Gbps)
Display	HDMI 2.0 / eDP 1.4 / 2x DSI / 2x DP 1.2
UPHY	Gen 2 \| 1x4 + 1x1 OR 2x1 + 1x2, USB 3.0 + USB 2.0
Size	87 mm x 50 mm
Mechanical	400-pin connector with Thermal Transfer Plate (TTP)

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Overview
Specs

Explore new AI capabilities at the edge with the NVIDIA Jetson TX2 4GB. This embedded computer lets you run neural networks with double the compute performance or double the power efficiency of Jetson TX1—at the same price.

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Technical Specifications
GPU	NVIDIA Pascal^™ architecture with 256 NVIDIA CUDA cores 1.3 TFLOPS (FP16)
CPU	Dual-core Denver 2 64-bit CPU and quad-core ARM A57 complex
Memory	4 GB 128-bit LPDDR4 1600 MHz - 51.2 GBs
Storage	16 GB eMMC 5.1
Video Encode	500 MP/sec 1x 4K @ 60 (HEVC) 3x 4K @ 30 (HEVC) 4x 1080p @ 60 (HEVC) 8x 1080p @ 30 (HEVC)
Video Decode	1000 MP/sec 2x 4K @ 60 (HEVC) 4x 4K @ 30 (HEVC) 7x 1080p @ 60 (HEVC) 14x 1080p @ 30 (HEVC)
Connectivity	Wi-Fi requires external chip
	10/100/1000 BASE-T Ethernet
Camera	12 lanes MIPI CSI-2, D-PHY 1.2 (30 Gbps)
Display	HDMI 2.0 / eDP 1.4 / 2x DSI / 2x DP 1.2
UPHY	Gen 2 \| 1x4 + 1x1 OR 2x1 + 1x2, USB 3.0 + USB 2.0
Size	87 mm x 50 mm
Mechanical	400-pin connector with Thermal Transfer Plate (TTP)

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Overview
Specs

Jetson^™ TX2i module’s rugged design, small form factor, and reduced power envelope make it ideal for high-performance edge computing devices such as industrial robots, machine vision cameras, and portable medical equipment.

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Technical Specifications
GPU	NVIDIA Pascal^™ architecture with 256 NVIDIA CUDA cores 1.3 TFLOPS (FP16)
CPU	Dual-core Denver 2 64-bit CPU and quad-core ARM A57 complex
Memory	8 GB 128-bit LPDDR4 1600MHz - 51.2 GB/s
Storage	32 GB eMMC 5.1
Video Encode	500 MP/sec 1x 4K @ 60 (HEVC) 3x 4K @ 30 (HEVC) 4x 1080p @ 60 (HEVC) 8x 1080p @ 30 (HEVC)
Video Decode	1000 MP/sec 2x 4K @ 60 (HEVC) 4x 4K @ 30 (HEVC) 7x 1080p @ 60 (HEVC) 14x 1080p @ 30 (HEVC)
Connectivity	Wi-Fi requires external chip
	10/100/1000 BASE-T Ethernet
Camera	12 lanes MIPI CSI-2, D-PHY 1.2 (30 Gbps)
Display	HDMI 2.0 / eDP 1.4 / 2x DSI / 2x DP 1.2
UPHY	Gen 2 \| 1x4 + 1x1 OR 2x1 + 1x2, USB 3.0 + USB 2.0
Size	87 mm x 50 mm
Mechanical	400-pin connector with Thermal Transfer Plate (TTP)