Ultra-Fast Chip Interconnect Technology for Custom Silicon Integration

NVLink-C2C extends the industry-leading NVIDIA® NVLink® technology to a chip-to-chip interconnect. This enables the creation of a new class of integrated products with NVIDIA partners, built via chiplets, allowing NVIDIA GPUs, DPUs, and CPUs to be coherently interconnected with custom silicon.

Building Semi-Custom Chip Designs

The design and layout of a chip-to-chip interconnect is vital to proper function, performance, power efficiency, reliability, and fabrication yield. NVIDIA NVLink-C2C is built on top of the world-class SerDes and Link design technology. With advanced packaging, NVLink-C2C interconnect delivers up to 25X more energy efficiency and is 90X more area-efficiency than a PCIe Gen 5 PHY on NVIDIA chips. NVLink-C2C is extensible from PCB-level integration, multi-chip modules (MCM), silicon interposer or wafer-level connections, enabling the industry’s highest bandwidth, while optimizing for both energy and area efficiency. The NVLink-C2C technology will be available for customers and partners who want to create semi-custom system designs.

Building Semi-Custom Chip Designs

The design and layout of a chip-to-chip interconnect is vital to proper function, performance, power efficiency, reliability, and fabrication yield. NVIDIA NVLink-C2C is built on top of the world-class SerDes and Link design technology. With advanced packaging, NVLink-C2C interconnect delivers up to 25X more energy efficiency and is 90X more area-efficiency than a PCIe Gen 5 PHY on NVIDIA chips. NVLink-C2C is extensible from PCB-level integration, multi-chip modules (MCM), silicon interposer or wafer-level connections, enabling the industry’s highest bandwidth, while optimizing for both energy and area efficiency. The NVLink-C2C technology will be available for customers and partners who want to create semi-custom system designs.

Products Using NVLink-C2C

NVIDIA Grace Hopper Superchip

NVIDIA Grace Hopper Superchip combines the Grace and Hopper architectures using NVIDIA NVLink-C2C to deliver a CPU+GPU coherent memory model for accelerated AI and high performance computing (HPC) applications.

NVIDIA Grace CPU Superchip

NVIDIA Grace CPU Superchip uses the NVLink-C2C technology to deliver 144 Arm® v9 cores and 1 TB/s of memory bandwidth.

NVLink-C2C Benefits

High Bandwidth

High Bandwidth

Supports high-bandwidth coherent data transfers between processors and accelerators.

Low Latency

Low Latency

Supports atomics between processors and accelerators to perform fast synchronization and high frequency updates to shared data.

Low Power and High Density

Low Power High Density

Uses advanced packaging to deliver 25X more energy efficiency and 90X more area-efficiency than PCIe Gen 5 PHY on NVIDIA chips.

Industry Standards

Industry Standards

Supports Arm’s AMBA CHI or CXL industry standard protocols for interoperability between devices.

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