NVIDIA® Jetson AGX Xavier™ sets a new bar for compute density, energy efficiency, and AI inferencing capabilities on edge devices.  It’s the next evolution in next-generation intelligent machines with end-to-end autonomous capabilities.

  • SIZE
  • PERFORMANCE
  • POWER

A BREAKTHROUGH IN EMBEDDED APPLICATIONS

At just 100 x 87 mm, Jetson AGX Xavier offers big workstation performance at 1/10 the size of a workstation. This makes it ideal for autonomous machines like delivery and logistics robots, factory systems, and large industrial UAVs.

TAKING PERFORMANCE TO THE EDGE

As the world’s first computer designed specifically for autonomous machines, Jetson AGX Xavier has the performance to handle visual odometry, sensor fusion, localization and mapping, obstacle detection, and path planning algorithms critical to next-generation robots. Get GPU workstation-class performance with up to an unparalleled 32 TeraOPS (TOPS) of peak compute and 750 Gbps of high-speed I/O in a compact form factor.

THE POWER OF FLEXIBILITY

Jetson AGX Xavier enables new levels of compute density, power efficiency, and AI inferencing capabilities at the edge.  Users can configure operating modes for their applications at 10W or 20W with the lower-power and lower-price Jetson AGX Xavier 8GB module, or at 10W, 15W, or 30W with the Jetson AGX Xavier module.

NVIDIA Jeston AGX Xavier

A Jetson AGX Xavier For Any Application

The Jetson AGX Xavier series of embedded modules includes the lower-power, lower-price Jetson AGX Xavier 8GB, which offers full hardware and software compatibility with Jetson AGX Xavier while delivering up to 20 TOPS of AI performance, and Jetson AGX Xavier with up to 32 TOPS of AI performance. Both benefit from NVIDIA’s rich set of AI tools and workflows, enabling developers to train and deploy neural networks quickly.

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Shop All Jetson AGX Xavier Products

  • Developer Kit
  • JETSON AGX XAVIER 8GB MODULE
  • JETSON AGX XAVIER MODULE
  • Overview
  • Specs

With the NVIDIA Jetson AGX Xavier developer kit, you can easily create and deploy end-to-end AI robotics applications for manufacturing, delivery, retail, smart cities, and more. Supported by NVIDIA JetPack and DeepStream SDKs, as well as CUDA®, cuDNN, and TensorRT software libraries, the kit provides all the tools you need to get started right away. And because it’s powered by the new NVIDIA Xavier processor, you now have more than 20X the performance and 10X the energy efficiency of its predecessor, the NVIDIA Jetson TX2. Get started today with the Jetson AGX Xavier Developer Kit.

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Developer Kit I/Os
PCIe X16 X8 PCIe Gen4/x8 SLVS-EC
RJ45 Gigabit Ethernet
USB-C 2x USB 3.1, DP (Optional), PD (Optional)
Close-System Debug and Flashing Support on 1 Port
Camera Connector (16x) CSI-2 Lanes
M.2 Key M NVMe
M.2 Key E PCIe x1 + USB 2.0 + UART (for Wi-Fi/LTE) / I2S + DMIC + GPIOs
HD Audio Header High-Definition Audio
eSTATp + USB 3.0 Type A SATA Through PCIe x1 Bridge + USB 3.0 (PD + Data for 2.5-inch SATA)
HDMI Type A/eDP/DP HDMI 2.0, eDP 1.2a, DP 1.4
uSD/UFS Card Socket SD/UFS
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Jetson AGX Xavier Developer Kit
  • Overview
  • SPECS

Jetson AGX Xavier 8GB is a lower-power lower-price Jetson AGX Xavier offering full hardware and software compatibility with the existing Jetson AGX Xavier. It consumes a maximum of 20W for the full module whilst delivering up to 20 TOPS of AI performance.

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Technical Specifications
GPU NVIDIA Volta™ architecture with 384 NVIDIA CUDA cores and 48 Tensor cores
5.5 TFLOPS (FP16)
11.1 TOPS (INT8)
DL Accelerator 4.1 TFLOPS (FP16)
8.2 TOPS (INT8)
CPU 6-core Carmel ARM v8.2 64-bit CPU, 8MB L2 + 4MB L3
Memory 8GB 256-bit LPDDR4x - 1333 MHz - 85.3 GB/s
Display Three multi-mode DP 1.2a/e DP 1.4/HDMI 2.0 a/b
Storage 32GB eMMC 5.1
Vision Accelerator 7-Way VLIW Vision Processor
Video Encode 2x464 MP/sec
2x 4K @ 30 (HEVC)
6x 1080p @ 60 (HEVC)
14x 1080p @ 30 (HEVC)
Video Decode 2x690 MP/sec
2x 4K @ 60 (HEVC)
4x 4K @ 30 (HEVC)
12x 1080p @ 60 (HEVC)
24x 1080p @ 30 (HEVC)
16x 1080p @ 30 (H.264)
Camera 16 lanes MIPI CSI-2, 8 lanes SLVS-EC
D-PHY (40 Gbps), C-PHY(64 Gbps)
UPHY 3x USB 3.1, 4x USB 2.0
1 x8 or 1 x4 or 1 x2 or 2 x1 PCIe (Gen3)
Other UART, SPI, CAN, I2C, I2S, DMIC, GPIOs
Connectivity Wi-Fi requires external chip
10/100/1000 RGMII
Gigabit Ethernet
Size 100 mm x 87 mm
Mechanical 699 pin Connector
Integrated Thermal Transfer Plate

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Jetson AGX Xavier Module
  • Overview
  • SPECS

The Jetson AGX Xavier module makes AI-powered autonomous machines possible, running in as little as 10W and delivering up to 32 TOPs. As part of the world’s leading AI computing platform, it benefits from NVIDIA’s rich set of AI tools and workflows, enabling developers to quickly train and deploy neural networks.

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Technical Specifications
GPU NVIDIA Volta™ architecture with 512 NVIDIA CUDA cores and 64 Tensor cores
11 TFLOPS (FP16)
22 TOPS (INT8)
DL Accelerator 5 TFLOPS (FP16)
10 TOPS (INT8)
CPU 8-Core Carmel ARM v8.2 64-Bit CPU, 8 MB L2 + 4 MB L3
Memory 16 GB 256-Bit LPDDR4x 2133 MHz - 136.5 GB/s
Display Three multi-mode DP 1.2a/e DP 1.4/HDMI 2.0 a/b
Storage 32 GB eMMC 5.1
Vision Accelerator 7-Way VLIW Vision Processor
Video Encode 2x1000 MP/sec
4x 4K @ 60 (HEVC)
8x 4K @ 30 (HEVC)
16x 1080p @ 60 (HEVC)
32x 1080p @ 30 (HEVC)
Video Decode 2x1500 MP/sec
2x 8K @ 30 (HEVC)
6x 4K @ 60 (HEVC)
12x 4K @ 30 (HEVC)
26x 1080p @ 60 (HEVC)
52x 1080p @ 30 (HEVC)
30x 1080p @ 30 (H.264)
Camera 16 lanes MIPI CSI-2, 8 lanes SLVS-EC
D-PHY (40 Gbps), C-PHY(109 Gbps)
UPHY (8x) PCIe Gen4 / (8x) SLVS-EC
(3x) USB 3.1
Single Lane UFS
Other UART, SPI, CAN, I2C, I2S, DMIC, GPIOs
Connectivity Wi-Fi requires external chip
10/100/1000 RGMII
Gigabit Ethernet
Size 87 mm x 100 mm
Mechanical 699 pin Molex Mirror Mex Connector
Integrated Thermal Transfer Plate

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Jetson AGX Xavier Module

TECHNICAL SPECIFICATIONS

  Jetson AGX Xavier 8GB Jetson AGX Xavier
GPU 384-Core Volta GPU with 48 Tensor cores

5.5 TFLOPS (FP16)
11.1 TOPS (INT8)		 512-Core Volta GPU with 64 Tensor cores

11 TFLOPS (FP16)
22 TOPS (INT8)
DL Accelerator (2x) NVDLA Engines

4.1 TFLOPS (FP16)
8.2 TOPS (INT8)		 (2x) NVDLA Engines

5 TFLOPS (FP16)
10 TOPS (INT8)
CPU 6-core Carmel ARM v8.2 64-bit CPU, 8MB L2 + 4MB L3 8-core Carmel ARM v8.2 64-Bit CPU, 8MB L2 + 4MB L3
Memory 8GB 256-bit LPDDR4x
1333 MHz - 85.3 GB/s		 16GB 256-bit LPDDR4x
2133 MHz - 136.5 GB/s
Display Three multi-mode DP 1.2/eDP 1.4/HDMI 2.0
Storage 32GB eMMC 5.1
Vision Accelerator 7-Way VLIW Vision Processor
Video Encode 2x464 MP/sec
2x 4K @ 30 (HEVC)
6x 1080p @ 60 (HEVC)
14x 1080p @ 30 (HEVC)		 2x1000 MP/sec
4x 4K @ 60 (HEVC)
8x 4K @ 30 (HEVC)
16x 1080p @ 60 (HEVC)
32x 1080p @ 30 (HEVC)
Video Decode 2x690 MP/sec
2x 4K @ 60 (HEVC)
4x 4K @ 30 (HEVC)
12x 1080p @ 60 (HEVC)
24x 1080p @ 30 (HEVC)
16x 1080p @ 30 (H.264)		 2x1500 MP/sec
2x 8K @ 30 (HEVC)
6x 4K @ 60 (HEVC)
12x 4K @ 30 (HEVC)
26x 1080p @ 60 (HEVC)
52x 1080p @ 30 (HEVC)
30x 1080p @ 30 (H.264)
Camera 16 lanes MIPI CSI-2, 8 lanes SLVS-EC
D-PHY (40 Gbps)
C-PHY (64 Gbps) 		16 lanes MIPI CSI-2, 8 lanes SLVS-EC
D-PHY (40 Gbps)
C-PHY (109 Gbps)
UPHY 3x USB 3.1, 4x USB 2.0
1 x8 or 1 x4 or 1 x2 or 2 x1 PCIe (Gen3)
 3x USB 3.1, 4x USB 2.0
1 x8 or 1 x4 or 1 x2 or 2 x1 PCIe (Gen4)
Other UART, SPI, CAN, I2C, I2S, DMIC, GPIOs
Connectivity Wi-Fi requires external chip
10/100/1000 RGMII
Gigabit Ethernet
Size 100 mm x 87 mm
Mechanical 699 pin Connector
Integrated Thermal Transfer Plate
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