NVIDIA NVLink-C2C
Extending NVLink to chip-level integration.
Ultra-Fast Chip Interconnect Technology for Custom Silicon Integration
NVIDIA NVLink™-C2C extends the industry-leading NVLink technology to a chip-to-chip interconnect. This enables the creation of a new class of integrated products with NVIDIA partners, built via chiplets, allowing NVIDIA GPUs or CPUs to have a high-bandwidth, coherent connection with custom silicon.
Building Semi-Custom Chip Designs
The design and layout of a chip-to-chip interconnect is vital to proper function, performance, power efficiency, reliability, and fabrication yield. NVIDIA NVLink-C2C is built on world-class SerDes and Link design technology. With advanced packaging, NVLink-C2C interconnect delivers up to 6x more energy efficiency and 3.5x more area efficiency than a PCIe Gen 6 PHY on NVIDIA chips. NVLink-C2C is extensible from PCB-level integration, multi-chip modules (MCM), and silicon interposer or wafer-level connections, enabling the industry’s highest bandwidth, while optimizing for both energy and area efficiency. Through NVLink Fusion, the NVLink-C2C technology will be available for customers and partners who want to create semi-custom system designs.
Products Using NVLink-C2C
NVLink-C2C Benefits
Learn more about NVIDIA NVLink.