Design space is infinite. Schedules aren’t. GPU-accelerated EDA compresses the path from RTL to sign-off so teams explore more and respin less.
Powering semiconductor breakthroughs with AI, digital twins, and accelerated computing.
Image courtesy of TSMC
Introduction
Shrinking nodes, 3D integration, and chiplet architectures are pushing compute demands beyond what CPU-based tools can sustain. Fabs and OSATs face the same pressure from the manufacturing side, needing higher throughput, better yields, and tighter process control at every node.
NVIDIA platforms combine GPUs, NVIDIA Vera CPUs, high-speed interconnects, NVIDIA CUDA-X™ and NVIDIA Omniverse™ libraries to accelerate computing, power AI, and real time digital twins, across the full semiconductor workflow, from design and verification to fab operations, inspection, and test.
From design and verification to lithography, fab optimization, inspection, and test, NVIDIA powers critical semiconductor workflows with full‑stack acceleration.
Learn how leading semiconductor innovators use NVIDIA-accelerated computing to boost yield, increase throughput, and cut costs.
Semiconductor workloads demand high performance, massive scale, and tight integration across tools, data, and infrastructure. NVIDIA delivers a full‑stack platform for core workload acceleration, engineering with AI software, and real-time digital twins built for compute‑intensive design, simulation, and manufacturing.
Electronic Design Automation (EDA) is the category of software tools used to design and verify integrated circuits. NVIDIA accelerates EDA by combining GPUs and CUDA-X libraries with tools from partners like Cadence and Synopsys to dramatically compress the time required to move from RTL to chip sign-off.
cuLitho is an NVIDIA CUDA-X library designed to accelerate computational lithography—the process of optimizing photomasks to counteract patterning issues during chip manufacturing. By moving full-chip lithography simulation to GPUs, cuLitho compresses what historically took days of computation into a matter of hours, enabling faster time-to-yield.
cuDSS is a foundational solver library within the NVIDIA CUDA-X platform, designed to provide core workload acceleration for EDA and other computationally-intensive processes. It delivers highly optimized solvers for tasks that are critical to electronic design automation tools.
cuEST is a component of the NVIDIA CUDA-X libraries used for atomic-level modeling and simulation in the semiconductor workflow. It provides acceleration for highly detailed simulations required in materials science and process engineering.
PhysicsNeMo are AI surrogate models that use AI physics to accelerate reactor simulation. They replace computationally complex, multi-day simulations of etch and deposition reactors—which involve coupled physics—with evaluations that take milliseconds, significantly accelerating chamber design and process development.
NVIDIA Omniverse is a platform used to build and operate real-time digital twins. In the semiconductor industry, it simulates entire fabs and manufacturing facilities to optimize operations, test new workflows, and orchestrate smarter factories by creating a virtual replica of the physical world.
The NVIDIA full-stack platform combines GPUs (such as Blackwell), NVIDIA Vera CPUs, high-speed interconnects, and a software layer that includes the NVIDIA CUDA-X™ libraries (like cuLitho, cuDSS, and cuEST) and the NVIDIA Omniverse™ platform for digital twins.
Core Workload Acceleration leverages the NVIDIA CUDA-X platform, including foundational solver libraries like cuDSS, as well as domain-specific tools such as cuLitho for lithography and cuEST for atomic-level modeling.
Major partners span the entire workflow, including EDA leaders like Cadence and Synopsys, manufacturing equipment suppliers such as Lam Research, and chipmakers like TSMC and Samsung, all of whom are leveraging NVIDIA's platforms to accelerate their processes.
Agentic AI refers to the autonomous software agents used primarily in the design and verification stages (e.g., executing chip design tasks), while physical AI is used for intelligent automation in the manufacturing process itself, leveraging tools and sensors to optimize quality and productivity on the factory floor.
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